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- miniature size - wide capacitance and voltage range - tape & reel for surface mount assembly - low esr - general electronic circuit general features applications part numbering cl 10 b 104 k b 8 n n n c 1 2 3 4 5 6 7 8 9 10 11 samsung multilayer ceramic capacitor 1 size(mm) 2 general multilayer ceramic capacitors general capacitors code eia code size(mm) 03 0201 0.6 0.3 05 0402 1.0 0.5 10 0603 1.6 0.8 21 0805 2.0 1.25 31 1206 3.2 1.6 32 1210 3.2 2.5 43 1812 4.5 3.2 55 2220 5.7 5.0 samsung multilayer ceramic capacitor thickness option size(mm) product & plating method capacitance temperature characteristic samsung control code nominal capacitance reserved for future use capacitance tolerance packaging type rated voltage 1 2 3 4 5 6 7 8 9 108 118 mlcc is an electronic part that temporarily stores an electrical charge and the most prevalent type of capacitor today. new technologies have enabled the mlcc manufacturers to follow the trend dictated by smaller and smaller electronic devices such as cellular telephones, computers, dsc, dvc
code temperature characteristics temperature range c class cog c 0 30(ppm/ ) -55 ~ +125 p p2h p -150 60 r r2h r -220 60 s s2h s -330 60 t t2h t -470 60 u u2j u -750 60 l s2l s +350 ~ -1000 a class x5r x5r 15% -55 ~ +85 b x7r x7r 15% -55 ~ +125 x x6s x6s 22% -55 ~ +105 f y5v y5v +2 2 ~ -82 % -30 ~ +85 temperature characteristics below 2.0pf 2.2 ~ 3.9pf above 4.0pf above 10pf c c0g c0g c0g c0g p - p2j p2h p2h r - r2j r2h r2h s - s2j s2h s2h t - t2j t2h t2h u - u2j u2j u2j temperature characteristic j : 120ppm/ , h : 60ppm/ , g : 30ppm/ capacitance temperature characteristic 3 nominal capacitance is identified by 3 digits. the first and second digits identify the first and second significant figures of the capacitance. the third digit identifies the multiplier. 'r' identifies a decimal point. code nominal capacitance 1r5 1.5pf 103 10,000pf, 10nf, 0.01 f 104 100,000pf, 100nf, 0.1 f nominal capacitance 4 example general capacitors
code tolerance nominal capacitance a 0.05pf less than 10pf (including 10pf) b 0.1pf c 0.25pf d 0.5pf f 1pf f 1% more than 10pf g 2% j 5% k 10% m 20% z +80, -20% code rated voltage code rated voltage r 4.0v d 200v q 6.3v e 250v p 10v g 500v o 16v h 630v a 25v i 1,000v l 35v j 2,000v b 50v k 3,000v c 100v capacitance tolerance 5 rated voltage 6 general capacitors
thickness option 7 general capacitors code electrode termination plating type a pd ag sn_100% n ni cu sn_100% g cu cu sn_100% code description of the code code description of the code a array (2-element) n normal b array (4-element) p automotive c high - q l licc product & plating method 8 samsung control code 9 size code thickness(t) size code thickness(t) 0201(0603) 3 0.30 0.03 1812(4532) f 1.25 0.20 0402(1005) 5 0.50 0.05 h 1.6 0.20 0603(1608) 8 0.80 0.10 i 2.0 0.20 0805(2012) a 0.65 0.10 j 2.5 0.20 c 0.85 0.10 l 3.2 0.30 f 1.25 0.10 2220(5750) f 1.25 0.20 q 1.25 0.15 h 1.6 0.20 y 1.25 0.20 i 2.0 0.20 1206(3216) c 0.85 0.15 j 2.5 0.20 f 1.25 0.15 l 3.2 0.30 h 1.6 0.20 1210(3225) f 1.25 0.20 h 1.6 0.20 i 2.0 0.20 j 2.5 0.20 v 2.5 0.30
code description of the code n reserved for future use code packaging type code packaging type b bulk f embossing 13" (10,000ea) p bulk case l paper 13" (15,000ea) c paper 7" o paper 10" d paper 13" (10,000ea) s embossing 10" e embossing 7" reserved for future use 10 6 packaging type 11 general capacitors appearance and dimension l bw t w code eia code dimension ( mm ) l w t(max) bw 03 0201 0.6 0.03 0.3 0.03 0.33 0.15 0.05 05 0402 1.0 0.05 0.5 0.05 0.55 0.2 +0.15/-0.1 10 0603 1.6 0.1 0.8 0.1 0.9 0.3 0.2 21 0805 2.0 0.1 1.25 0.1 1.35 0.5 +0.2/-0.3 31 1206 3.2 0.15 1.6 0.15 1.40 0.5 +0.2/-0.3 3.2 0.2 1.6 0.2 1.8 0.5 +0.3/-0.3 32 1210 3.2 0.3 2.5 0.2 2.7 0.6 0.3 3.2 0.4 2.5 0.3 2.8 43 1812 4.5 0.4 3.2 0.3 3.5 0.8 0.3 55 2220 5.7 0.4 5.0 0.4 3.5 1.0 0.3
general capacitors no item performa nce test condit ion 1 appearance no abnormal exterior appearance through microscope(10) 2 insulation resistance 10,000 ? or 500 ? ? whichever is smaller rated voltage is below 16v ; 10,000 ? or 100 ? ? whichever is smaller apply the rated voltage for 60 ~ 120 sec. 3 withstanding voltage no dielectric breakdown or mechanical breakdown class : 300 % of the rated voltage for 1~5 sec. class :2 50% of the rated voltage for 1~5 sec. is applied with less than 50 ? current 4 capacita nce class within the specified tolerance capacitance frequency voltage 1,0 00 ? 1 ? 1 0% 0.5 ~ 5 v rms >1,000 ? 1 ? 1 0% class within the specified tolerance capacitance frequency voltage 10 ? 1 ? 1 0% 1 .0 0 .2 v rms >1 0 ? 120 ? 20% 0.50.1vrms 5q class capacitance 30 ? :q 1,000 <30 ? :q 40 0 +20 c ( c : capacitance ) capacitance frequency voltage 1,0 00 ? 1 ? 1 0% 0.5 ~ 5 v rms >1,000 ? 1 ? 1 0% 6tan class 1. characteristic : a(x5r), b(x7r), x(x6s) 2. characteristic : f(y5v) capacitance frequency voltage 10 ? 1 ? 1 0% 1 .0 0 .2 v rms >1 0 ? 120 ? 20% 0.50.1vrms rated voltage spec 25v 0.025 max 16v 0.035 max 10v 0.05 max 6.3v 0.05 max/ 0.10max* 1 rated voltage spec 50v 0.05 max, 0.07max* 2 35v 0.07 max 25v 0.05 max/ 0.07 max* 3 / 0.09max* 4 16v 0.09 max/ 0.125max* 5 10v 0.125 max/ 0.16max* 6 6.3v 0.16max *3. 0402 c 0.033uf, 0603 c>0.1uf all 0805, 1206 size, 1210 c 6.8uf *4.. 1210 c>6.8uf *5.. 0402 c 0.22uf *6.. all 1812 size *2.. 0603 c 0.47uf, 0805 c 1uf *1. 0201 c 0.022uf, 0402 c 0.22uf, 0603 c 2.2uf, 0805 c 4.7uf, 1206 c 10uf, 1210 c 22 u f, 1812 c 47uf, 2220 c 100uf, all low profile capacitors (p.16). reliabilty test condition
general capacitors no item performa nce test condit ion 7 temperature characteristics of capacitance class capacitance shall be measured by the steps shown in the following table. (1) class temperature coefficient shall be calculated from the formula as below. c1 t 10 6 [ppm/ ] c2 - c1 temp, coefficient = c1; capacitance at step 3 c2: capacitance at 85 t: 60 (=85 -25 ) (2) class capacitance change shall be calculated from the formula as below. 100(%) c2 - c1 c1 c= c1; capacitance at step 3 c2: capacitance at step 2 or 4 class 8 adhesive strength of termination no indication of peeling shall occur on the terminal electrode. apply 500g.f * pressure for 10 1sec. * 200g.f for 0201 case size. 9 bending strength apperance no mechanical damage shall occur. bending limit ; 1mm test speed ; 1.0mm/sec. keep the test board at the limit point in 5 sec., then measure capacitance. capacitance characteristics capacitance change class i within 5% or 0. 5 pf whichever is larger class ii a(x5r)/ b(x7r)/ x(x6s) within 12.5% f(y5v) within 30% characteristics capacitance change with no bias a(x5r)/ b(x7r) 15% x(x6s) 22% f(y5v) +22% ~ -82% 500g.f characteristics temp. coefficient (ppm/ ) c0g 0 30 ph -150 60 rh -220 60 sh -330 60 th -470 60 ul -750 120 sl +350 ~ -1000 step temp.( ) 125 2 2 min. operating temp. 2 325 2 4 max. operating temp 2 525 2 50 r=230 20 45 1 45 1 bending limit reliabilty test condition
general capacitors no item performa nce test condition 10 solder ability more than 75% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve 11 resistance to soldering heat apperance no mechanical damage shall occur. solder temperature : 2705 dip time : 101 sec. each termination shall be fully immersed and preheated as below : leave the capacitor in ambient condition for specified time* before measurement *242hours(class ) 24 2 hours (class ) capacitance characteristics capacitance change class within 2.5% or 0.25 ? whichever is larger class a(x5r)/ b(x7r) within 7.5% x(x6s) within 15% f within 20% q (class ) capacitance 30 ? :q 1000 <30 ? :q 400+20c (c: capacitance) tan (class ) within the specified initial value insulation resistance within the specified initial value withstanding voltage within the specified initial value 12 vibration test appearance no mechanical damage shall occur. the capacitor shall be subjected to a harmonic motion having a total amplitude of 1.5mm changing frequency from 10hz to 55hz and back to 10hz in 1 min. repeat this for 2hours each in 3 mutually perpendicular directions capacitance characteristics capacitance change class within 2.5% or 0.25 ? whichever is larger class a(x5r)/ b(x7r) within 5% x(x6s) within 10% f(y5v) within 20% q (class ) within the specified initial value tan (class ) within the specified initial value insulation resistance within the specified initial value step temp.( ) time(sec.) 1 80~100 60 2 150~180 60 solder sn-3ag-0.5cu 63sn-37pb solder temp. 2455 2355 flux rma type dip time 30.3 sec. 50.5 sec. pre-heating at 80~120 for 10~30 sec. reliabilty test condition
general capacitors no item performance test condition 13 humidity (steady state) appearance no mechanical damage shall occur. temperature : 402 relative humidity : 90~95 %rh duration time : 500 +12/-0 hr. leave the capacitor in ambient condition for specified time* before measurement. class :242hr. class :242hr. capacitance characteristics capacitance change class within 5.0% or 0.5 ? whichever is larger class a(x5r)/ b(x7r)/ x(x6s) within 12.5% f(y5v) within 30% q class capacitance 30 ? :q 350 10 capacitance <30 ? :q 275 + 2.5c capacitance < 10pf : q 200 + 10c (c: capacitance) tan class 1. characteristic : a(x5r), b(x7r) 0.05max (16v and over) 0.075max (10v) 0.075max (6.3v except table 1) 0.125max* (refer to table 1) 2. characteristic : f(y5v) 0.075max (25v and over) 0.1max (16v, c<1.0 ? ) 0.125max(16v, c 1.0 ? ) 0 .15 ma x ( 10 v) 0.195max (6.3v) insulation resistance 1,000 ? or 50 ? ? whichever is smaller. 14 moisture resistance appearance no mechanical damage shall occur. applied voltage : rated voltage temperature : 402 humidity : :90~95%rh duration time : 500 +12/-0 hr. charge/discharge current : 50 ? max. perform the initial measurement according to note1 . perform the final measurement according to note2. capacitance characteristics capacitance change class within 5.0% or 0.5 ? whichever is larger class a(x5r)/ b(x7r)/ x(x6s) within 12.5% within 12.5% within 30% f(y5v) within 30% within 30% q (class ) capacitance 30 ? :q 20 0 capacitance <30 ? :q 10 0 + 10 /3c (c: ca p acita nce ) tan (class ) 1. characteristic : a(x5r), b(x7r) 0.05max (16v and over) 0.075max (10v) 0.075max (6.3v except table 1) 0.125max* (refer to table 1) 2. characteristic : f(y5v) 0.075max (25v and over) 0.1max (16v, c<1.0 ? ) 0.125max(16v, c 1.0 ? ) 0 .15 ma x ( 10 v) 0.195max (6.3v) x(x6s) 0.11max (6.3v and below) insulation resistance 500 ? or 25 ? ? whichever is smaller. reliabilty test condition
general capacitors no item performance test condition 15 high temperature resistance appearance no mechanical damage shall occur. applied voltage : 200%* of the rated voltage temperature : max. operating temperature duration time : 1000 +48/-0 hr. charge/discharge current : 50 ? max. * refer to table(3) : 1 50%/100% of the rated voltage perform the initial measurement according to note1 for class perform the final measurement according to note2. capacitance characteristics capacitance change class within 3% or 0.3 ? , whichever is larger class a(x5r)/ b(x7r) within 12.5% x(x6s) within 25% f(y5v) within 30% within 30% q (class ) capacitance 30 ? :q 350 10 capacitance <30 ? :q 275 + 2.5c capacitance < 10 ? :q 200 +10c (c: capacitance) tan (class ) 1. characteristic : a(x5r), b(x7r) 0.05max (16v and over) 0.075max (10v) 0.075max (6.3v except table 1) 0.125max* (refer to table 1) 2. characteristic : f(y5v) 0.075max (25v and over) 0.1max(16v, c<1.0 ? ) 0.125max(16v, c 1.0 ? ) 0.15max ( 10v) 0.195max (6.3v) x(x6s) 0.11max (6.3v and below) insulation resistance 1,000 ? or 50 ? ? whichever is smaller. 16 temperature cycle appearance no mechanical damage shall occur. capacitor shall be subjected to 5 cycles. condition for 1 cycle : step temp.( ) time(min.) 1 min. operating temp.+0/-3 30 225 2~3 3 max. operating temp.+3/-0 30 425 2~3 leave the capacitor in ambient condition for specified time* before measurement *242hours(class ) 24 2 hours (class ) capacitance characteristics capacitance change class within 2.5% or 0.25 ? whichever is larger class a(x5r)/ b(x7r)/ within 7.5% x(x6s) within 15% f(y5v) within 20% q (class ) within the specified initial value tan (class ) within the specified initial value insulation resistance within the specified initial value reliabilty test condition
general capacitors reliabilty test condition note1. initial measurement for class perform the heat treatment at 150 +0/-10 for 1 hour. then leave the capacitor in ambient condition for 484 hours before measurement. then perform the measurement. note2. latter measurement 1. class leave the capacitor in ambient condition for 242 hours before measurement then perform the measurement. 2. class perform the heat treatment at 150 +0/-10 for 1 hour. then leave the capacitor in ambient condition for 484 hours before measurement. then perform the measurement. *table1. *table2. *table3. note3. all size in reliability test condition section is "inch" 18 recommended soldering method recommended soldering method by size & capacitance size inch (mm) temperature characteristic capacitance condition flow reflow 0201 (0603) --- 0402 (1005) 0603 (1608) class i - class ii c 1 ? c 1 ? - 0805 (2012) class i - class ii c 4.7 ? c 4.7 ? - array - - 1206 (3216) class i - class ii c 10 ? c 10 ? - array - - 1210 (3225) --- 1808 (4520) 1812 (4532) 2220 (5750) high temperature resistance test applied voltage 100% of the rated voltage 150% of the rated voltage class a(x5r), b(x7r), x(x6s), f(y5v) 0201 c 0.1 ? 0402 c 1.0 ? 0603 c 4.7 ? 0805 c 22.0 ? 1206 c 47.0 ? 1210 c 100.0 ? all low profile capacitors (p.16). 0201 c 0.022 ? 0402 c 0.47 ? 0603 c 2.2 ? 0805 c 4.7 ? 1206 c 10.0 ? 1210 c 22.0 ? 1812 c 47.0 ? 2220 c 100.0 ? high temperature resistance test c(y5v) 30% class f(y5v) 0402 c 0.47 ? 0603 c 2.2 ? 0805 c 4.7 ? 1206 c 10.0 ? 1210 c 22.0 ? 1812 c 47.0 ? 2220 c 100.0 ? tan 0.125max* class a(x5r), b(x7r) 0201 c 0.022 ? 0402 c 0.22 ? 0603 c 2.2 ? 0805 c 4.7 ? 1206 c 10.0 ? 1210 c 22.0 ? 1812 c 47.0 ? 2220 c 100.0 ? all low profile capacitors (p.16).
packaging general capacitors symbol a b w f e p1 p2 p0 d t type d i m e n s i o n 0603 (1608) 1.1 0.2 1.9 0.2 8.0 0.3 3.5 0.05 1.75 0.1 4.0 0.1 2.0 0.05 4.0 0.1 1.5 +0.1/-0 1.1 below 0805 (2012) 1.6 0.2 2.4 0.2 1206 (3216) 2.0 0.2 3.6 0.2 unit : mm symbol a b w f e p1 p2 p0 d t type d i m e n s i o n 0201 (0603) 0.38 0.03 0.68 0.03 8.0 0.3 3.5 0.05 1.75 0.1 2.0 0.05 2.0 0.05 4.0 0.1 1.5 +0.1/-0.03 0.37 0.03 0402 (1005) 0.62 0.04 1.12 0.04 0.6 0.05 unit : mm a b feeding hole d p0 p1 p2 w f e t a b feeding hole chip inserting hole d p0 p1 p2 w f e t chip inserting hole cardboard paper tape (4mm) cardboard paper tape (2mm)
packaging general capacitors symbol a b w f e p1 p2 p0 d t1 t0 type d i m e n s i o n 0805 (2012) 1.45 0.2 2.3 0.2 8.0 0 .3 3.5 0.05 1.75 0.1 4.0 0.1 2.0 0.05 4.0 0.1 1.5 +0.1/-0 2.5 max 0.6 below 1206 (3216) 1.9 0.2 3.5 0.2 1210 (3225) 2.9 0.2 3.7 0.2 1808 (4520) 2.3 0.2 4.9 0.2 12.0 0 .3 5.60 0.05 8.0 0.1 3.8 max 1812 (4532) 3.6 0.2 4.9 0.2 2220 (5750) 5.5 0.2 6.2 0.2 unit : mm a b feeding hole chip inserting hole d p0 p1 p2 w f e t1 t0 empty section 45 pitch packed part empty section 50 pitch loading section 35 pitch start end type symbol size cardboard paper tape symbol size em bossed plastic tape 7" reel c 0201(0603) 10,000 e all size 3216 1210(3225),1808(4520) (t 1.6mm) 2,000 0402(1005) 10,000 1210(3225)(t 2.0mm) 1,000 others 4,000 1808(4520)(t 2.0mm) 1,000 10" reel o - 10,000 - - - 13" reel d 0402(1005) 50,000 f all size 3216 1210(3225),1808(4520) (t<1.6mm) 10,000 others 10,000 1210(3225)(1.6 t<2.0mm) 1206(3216)(1.6 t) 8,000 l 0603(1608) 10,000 or 15,000 1210(3225),1808(4520) (t 2.0mm) 4,000 0805(2012) (t 0.85mm) 15,000 or 10,000(option) 1812(4532)(t 2.0mm) 4,000 1206(3216) (t 0.85mm) 10,000 1812(4532)(t>2.0mm) 5750(2220) 2,000 embossed plastic tape taping size
general capacitors reel dimension e c d r a w b t unit : mm symbol a b c d e w t r 7" reel 180+0/ -3 60+1/ -3 13 0.3 25 0.5 2.0 0.5 9 1.5 1.2 0.2 1.0 13" reel 330 2.0 80+1/ -3 2.2 0.2 packaging
general capacitors bulk case packaging a bt c d e f w l g h i unit : mm symbol a b t c d e dimension 6.8 0.1 8.8 0.1 12 0.1 1.5+0.1/-0 2+0/-0.1 3.0+0.2/-0 symbol f w g h l i dimension 3 1.5+0 .2 /- 0 36+0/-0.2 19 0.35 7 0.35 110 0.7 5 0.35 quantity of bulk case packaging size 0402(1005) 0603(1608) 0805(2012) t=0.65mm t=0.85mm quantity 50,000 10,000 or 15,000 10,000 5,000 or 10,000 unit : p cs - bulk case packaging can reduce the stock space and transportation costs. - the bulk feeding system can increase the productivity. - it can eliminate the components loss.
application manual general capacitors electrical characteristics ? capacitance change - aging ? impedance - frequency characteristics ? capacitance - dc voltage characteristics c0g 0.01 0.1 1 10 100 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 ohm 1mhz 10mhz 100mhz 1ghz 10ghz 1000pf 100pf 10pf x7r/x5r/y5v 0.01 0.1 1 10 100 1.e+06 1.e+07 1.e+08 1.e+09 ohm 0.1 ? 0.01 ? 0.001 ? 1mhz 10mhz 100mhz 1ghz ? capacitance - temperature characteristics 40 20 -20 -4 0 -60 -80 -20 -4 0 -60 25 40 60 80 10 0 12 0 x7r x5r y5v % c 40 20 -20 -4 0 -60 -80 -20 -4 0 -60 25 40 60 80 10 0 12 0 x7r x5r y5v % c 20 10 20 30 40 50 x7r 50v x7r 16v y5v c % vdc cog x5r 50v 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 20 10 20 30 40 50 x7r 50v x7r 16v y5v c % vdc cog x5r 50v 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 1 10 100 1000 10000 time(hr) c/c [%] y5v c0g x7r/x5r 5 10 15 1 10 100 1000 10000 time(hr) c/c [%] y5v c0g x7r/x5r 5 10 15 8 6 4 2 -4 -6 -8 -1 0 -2 -5 5 - 4 0 -2 0 25 40 60 80 100 125 s2l u2j cog % c tem p.( o c) o 8 6 4 2 -4 -6 -8 -1 0 -2 -5 5 - 4 0 -2 0 25 40 60 80 100 125 s2l u2j cog % c tem p.( o c) o
w b a solder land solder resist 2/3w < b < w t solder resist 2/3t < a < t general capacitors storage condition ? storage environment the electrical characteristics of mlccs were degraded by the environment of high temperature or humidity. therefore, the mlccs shall be stored in the ambient temperature and the relative humidity of less than 40 and 70%, respectively. guaranteed storage period is within 6 months from the outgoing date of delivery. ? corrosive gases since the solderability of the end termination in mlcc was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, mlccs must be avoid from these gases. ? temperature fluctuations since dew condensation may occur by the differenc es in temperature when the mlccs are taken out of storage, it is important to maintain the temperature-controlled environment . design of land pattern when designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. the amount of solder at the end terminations has a direct effect on the crack. the crack in mlcc will be easily occurred by the te nsile stress which was due to too much amount of solder. in contrast, if too li ttle solder is applied, the terminat ion strength will be insufficiently. use the following illustrations as guidelines for proper land design. recommendation of land shape and size.
adhesives when flow soldering the mlccs, apply the adhesive in accordance with the following conditions. ? requirements for adhesives they must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. they must maintain their adhesive strength when exposed to soldering temperature. they should not spread or run when applied to the circuit board. they should harden quickly. they should not corrode the circuit board or chip material. they should be a good insulator. they should be non-toxic, and not produce harmful gases, nor be harmful when touched. ? application method it is important to use the proper amount of adhesive. too little and much adhesive will cause poor adhesion and overflow into the land, respectively. ? adhesive hardening characteristics to prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less . mounting ? mounting head pressure excessive pressure will cause crack to mlccs. the pressure of nozzle will be 300g maximum during mounting. solder resist land pcb aa b c c type 21 31 a 0.2 min 0.2 min b 70~100 ? 70~100 ? c >0 >0 unit : mm general capacitors
too much solder not enough solder cracks tend to occur due to large stress w eak holding force may cause bad connections or detaching of the capacitor good support pin force nozzle general capacitors ? bending stress when double-sided circuit boards are used, mlccs first are mounted and soldered onto one side of the board. when the mlccs are mounted onto the other side, it is important to support the board as shown in the illustration. if the circuit board is not supported, the crack occur to the ready-installed mlccs by the bending stress. ? manual soldering manual soldering can pose a great risk of creating thermal cracks in chip capacitors. the hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. ? amount of solder
pre-heating gradual cooling in the air soldering temp.( ) 260+0/ - 5 10sec.max. time(sec) reflow 200 150 general capacitors ? cooling natural cooling using air is recommended. if the chips are dipped into solvent for cleaning, the temperature difference( t) must be less than 100 ? cleaning if rosin flux is used, cleaning usually is unnecessary. when strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fl uids, thereby affecting the chip capacitors. this means that the cleaning fluid must be carefully selected, and should always be new. ? notes for separating mult iple, shared pc boards. a multi-pc board is separated into many individual circuit boards after soldering has been completed. if the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. carefully choose a separation method that mi nimizes the bending often circuit board . ? recommended soldering profile
t i) 1206(3216) and below : 150 max. pre-heating gradual cooling in the air soldering temp. ( ) pre-heating temp. ( ) 120 sec. min. 2603 5 sec. max. time (sec.) flow soldering iron variation of temp. soldering temp ( ) pre-heating time (sec) soldering time(sec) cooling time(sec) t 130 30 0 10 max 60 4 - condition of iron facilities wattage tip diameter soldering time 20w max 3 L max 4secmax * caution - iron tip should not cont act with ceramic body directly. general capacitors

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